JPH0217851U - - Google Patents
Info
- Publication number
- JPH0217851U JPH0217851U JP9459288U JP9459288U JPH0217851U JP H0217851 U JPH0217851 U JP H0217851U JP 9459288 U JP9459288 U JP 9459288U JP 9459288 U JP9459288 U JP 9459288U JP H0217851 U JPH0217851 U JP H0217851U
- Authority
- JP
- Japan
- Prior art keywords
- heat dissipation
- island
- chip
- tab
- package structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims description 16
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000463 material Substances 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9459288U JPH0217851U (en]) | 1988-07-19 | 1988-07-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9459288U JPH0217851U (en]) | 1988-07-19 | 1988-07-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217851U true JPH0217851U (en]) | 1990-02-06 |
Family
ID=31319144
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9459288U Pending JPH0217851U (en]) | 1988-07-19 | 1988-07-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217851U (en]) |
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1988
- 1988-07-19 JP JP9459288U patent/JPH0217851U/ja active Pending